University of Kentucky 3 credits Materials Science and Engineering
Study of packaging systems which interconnect, support, power, cool, protect, and maintain electronic components. The course will address systems at the chip, board, and product levels. Topics include design, properties, materials, manufacture, and performance of various packaging systems. Laboratory will provide familiarity with design software and production equipment and processes. Prereq: EE 211 or EE 305, EE 360 or MSE 402G, or consent of instructor. (Same as EE 569.)
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