Wilkes University 3 credits Electrical Engineering
Theoretical and practical aspects of techniques utilized in the fabrication of semiconductor devices. Techniques of wet chemistry; deposition and diffusion; advanced concepts of contamination control; defect-free processing and gathering; complete characterization including junction penetration, resistivity, and oxide thickness. Switching speed, junction characteristics, leakage and gain, ion implantation, and method of fabrication. Extensive use of process simulation programs such as SUPREM. Pre-Requisites: EE 271.
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